Tungsten-copper alloy
Material Introduction: High strength, high thermal conductivity and low thermal expansion coefficient tungsten-copper alloy is produced by MIM process. This material is a pseudo alloy material compounded by tungsten and copper two-phase metals, which is applied to 5G communication connectors, electrical contact materials, heat dissipation materials, chip packaging materials, etc. with high thermal conductivity and low coefficient of thermal expansion requirements.
Element composition:
|
Model |
Cu |
W |
雜質(zhì)總和 |
|
W80Cu20 |
20±2 |
80±2 |
≤0.5 |
|
W70Cu30 |
30±2 |
70±2 |
≤0.5 |
Physical properties:
|
Properties |
Unit |
W80Cu20 |
W70Cu30 |
|
Density ρ |
g/cm3 |
>14.9 |
>13.6 |
|
Hardness |
Hv |
260 |
175 |
|
Tensile strength Rm |
MPa |
700 |
560 |
|
Yield strength Rp0.2 |
MPa |
600 |
410 |
|
Elongation A10 |
% |
0.5 |
1 |
|
Thermal conductivity |
W/(m·℃) |
172 |
200 |
|
Coefficient of thermal expansion |
25~200℃ μm/(m·℃) |
8.3 |
9.9 |
Metallography (×500)
左:W80Cu20；右：W70Cu30
